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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

134 pages • missing pub info (editions)

nonfiction art technology informative medium-paced
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

134 pages • missing pub info (editions)

nonfiction art technology informative medium-paced